Hebei Sinopack Electronic Technology — Post-IPO Equity
Hebei Sinopack Electronic Technology raised $337.4M in a Post-IPO Equity round. View investors, financials, and press on Fsome.
Round Details
- Funded Company
- Hebei Sinopack Electronic Technology
- Round Type
- Post-IPO Equity
- Amount Raised
- $337.4M
- Announced
- November 4, 2023
Canonical: https://fsome.com/funding/hebei-sinopack-electronic-technology-post-ipo-equity-6108099 · For the full investor list, press references, and related rounds, please enable JavaScript.