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Home › Funding Rounds › Tongfu Microelectronics — Post-IPO Equity

Tongfu Microelectronics — Post-IPO Equity

Tongfu Microelectronics raised $484.9M in a Post-IPO Equity round. View investors, financials, and press on Fsome.

Round Details

Funded Company: Tongfu Microelectronics
Round Type: Post-IPO Equity
Amount Raised: $484.9M
Announced: November 1, 2020

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