Boschman Technologies
Duiven
About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages. Our focus is on the following market segments: Smartcards and discrete packages MEMS and sensor packages Leadless and substrate-based packages Special application packages We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market.
Company Facts
- Operating status: Active
- Company type: For Profit
- IPO status: Private
- Employees: 1 – 10
- Estimated revenue: $1K – $10K
- Funding stage: Private Equity
- Last round: Private Equity (Mar 2017)
- Website: boschman.nl
- Phone: +31 263 194 900
Industries & Categories
Consumer, Packaging Services, Semiconductor
Social Profiles
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