Datacon Technology AG
Osterreicher
About Datacon Technology AG
Datacon is a global manufacturer of flip chip bonding, multichip die bonding and other related assembly equipment for the semiconductor and telecommunications industries. According to data for 2003 from VLSI, an independent research firm covering the semiconductor industry, Datacon is the world’s largest manufacturer of flip chip bonding equipment to the semiconductor industry. The use of flip chip bonding technology is critical for the needs of chip manufacturers to further shrink device sizes while increasing functionality for applications such as wireless telephony, personal digital assistants, consumer electronics and Internet infrastructure. Datacon’s largest customers are principally European and North American semiconductor manufacturers such as Epcos, Infineon, Bosch, ST Micro, Skyworks and Fairchild as well as Asian assembly subcontractors such as Amkor, ASE and Chippac STATS.
Company Facts
- Operating status: Active
- Company type: For Profit
- IPO status: Private
- Website: datacon.at
- Phone: [email protected]
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