Dewo Advanced
Baoan
About Dewo Advanced
Shenzhen Dewo Advanced Automation Corporation produces wire bonding equipment, integrating R and D, design, production, and sales. Their products such as semiconductor IC packaging, LED packaging, and precision electronic equipment. Their solutions such as SOP wire bonding solutions, LED packaging wire bonding solutions, SOT23 package wire bonding solutions, quad flat no-lead packages, quad flat no-lead packages, and quad flat no-lead package, quad flat no-lead packages.
Company Facts
- Operating status: Active
- Company type: For Profit
- IPO status: Private
- Employees: 11 – 50
- Funding stage: Early Stage Venture
- Last round: Series A (Dec 2022)
- Website: daa-inc.com
- Phone: 0755-2758-8510
Industries & Categories
Electronics, Manufacturing, Semiconductor
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